… His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. …
… Similarly, with the most recent round of attacks we are revisiting our security roadmap for GitHub Actions and accelerating actions security capabilities where work was already underway. You can give us feedback on the GitHub Actions security roadmap in the community discussion post . …
… AMD and TSMC continue to collaborate on process and packaging technologies. In addition to the 2nm node, AMD is leveraging advanced packaging technologies, including SoIC-X and CoWoS-L, across its broader data center and AI portfolio. …
… Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. …
… Related Story MediaTek Says Its Next-Gen Program Will Only Use Intel’s EMIB-T For Packaging If we go by the original plans, CPO was originally slated for commercialization by 2033, but NVIDIA fast-forwarded the optics roadmap by 5 years, bringing it forward in 2028 with its next-gen Feynman GPUs. …
… While it's still possible to use edge connectors, like Lightmatter's eClick, which transmit light through the edge of the chips with advanced packaging, they're more challenging to test and validate prior to packaging, he explained. …
… Advanced Packaging and 3D Integration As AI workloads continue to scale, advanced packaging technologies are becoming as critical as process nodes themselves. …
… SK hynix says the technology can be manufactured at scale using its existing Wafer Level Packaging WLP process, which is built on its Mass Reflow Molded Underfill MR-MUF packaging technology already used in commercial HBM products. …
… At the same time, there was a notable absence of new approvals for Specialty Devices and Advanced Packaging. …
… Process Flow: Packaging The other part of this is back-end packaging which Hynix continues to push forward with MR-MUF which we wrote about extensively here . …
