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TSMC

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TSMC's 2nm Secrets Were Stolen With Just a Smartphone Camera; The Engineers Behind It Now Face Up to 14 Years in Prison

…become a supplier of equipment for more sites in TSMC's advanced process, Chen Liming repeatedly asked Wu Bingjun and Ge Yiping, TSMC engineers who were working at the time, to provide…

Mar 30, 2026 · Muhammad Zuhair

TSMC's A16 '1.6nm' Node Promises 10% Speed Boost or 20% Power Cut Over 2nm, With Backside Power Hitting Production by Q4 2026

…The A16 and A14 nodes will play a key role in setting TSMC for the next generation of processes, such as A13 and A12. TSMC A13 (1.3nm) Process Node The TSMC…

May 2, 2026 · Hassan Mujtaba

TSMC Scrambles To Calm Furious Employees With Promises Of Bigger Bonuses After CEO's 30% Bonus Cut Comments Triggered Samsung-Style Revolt Fears

TSMC has moved rapidly to quell a wave of discontent among its employees following the widespread dissemination of rumors related to impending bonus cuts, with such fears only bolstered by the recent…

May 25, 2026 · Rohail Saleem

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TSMC's 2nm Secrets Were Stolen With Just a Smartphone Camera; The Engineers Behind It Now Face Up to 14 Years in Prison

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TSMC CEO C.C. Wei says, ‘It will be a long time before we can meet customer demand’ — tells shareholders that he will keep prices stable, refrain from implementing price hikes

TSMC-Fertigung: „Wir haben High-NA-EUV-Systeme, aber wir sagen nicht, wie viele“

NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing

TSMC Now Pays Its Biggest Customer NVIDIA, Pulling CUDA-X Into the Fab to Slash Lithography Costs by Up to 50%

TSMC's A16 '1.6nm' Node Promises 10% Speed Boost or 20% Power Cut Over 2nm, With Backside Power Hitting Production by Q4 2026

TSMC Scrambles To Calm Furious Employees With Promises Of Bigger Bonuses After CEO's 30% Bonus Cut Comments Triggered Samsung-Style Revolt Fears

TSMC COUPE: Silicon Photonics im Substrat/Interposer setzt Konkurrenz zu

TSMC N2U und N2A: „Ultra“-Version des 2-nm-Prozesses kommt für die Massen

TSMC-Neuheiten: SoIC-„X3D“-Stapeln weit vor CoPoS und Glas-Substrat wichtig

TSMC Maps Out A13 "1.3nm" & A12 "1.2nm" Nodes For 2029, Sidesteps ASML's Priciest EUV Tools For Now

TSMC A13/A12-Fertigungsprozess: „1,2 nm“ mit Super Power Rail (ohne High-NA-EUV) ab 2029

TSMC Doubles Down on 2nm With Five Fabs Ramping at Once, Output Set to Eclipse 3nm by 2x

TSMC 3nm & 2nm Wafer Output To Be Boosted By 20% By The End of 2026 As Supply Crunch Continues