SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers
… SK hynix says the technology can be manufactured at scale using its existing Wafer Level Packaging WLP process, which is built on its Mass Reflow Molded Underfill MR-MUF packaging technology already used in commercial HBM products. …