TSMC's 1.4 nm Fab Set for Completion by April 2027
… Same with N3E and N3B, we didn't see products till a year after TSMC announced they will enter HVM on that node. So when TSMC is claiming they will enter HVM on A14 in 2028...
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TSMC could start mass producing 1.6nm chips as soon as late 2026
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TSMC Develops EMIB-like Technology to Compete with Intel
… According to sources close to The Information, TSMC's Chip-on-Wafer-on-Substrate CoWoS packaging might lose some customers to Intel's EMIB. As a result, TSMC has begun developing its EMIB-like technology. …
TSMC Targets 100,000 N2 Wafers per Month by the End of 2026
… While TSMC hoped to achieve this number in the fourth quarter of 2026, demand has pushed production capacity to its limits, prompting TSMC to consider additional expansion plans for this node. …
TSMC Confirms Another $100 Billion for Arizona Expansion
… TSMC recently approved a record $45 billion package for 2026 alone, indicating that it would take around two years of capital expenditure to meet the demand for TSMC's Arizona expansion. …
TSMC Achieves Record $13.75 Billion Revenue in June 2026
… In June, TSMC successfully began high-volume manufacturing of the N2 process. AMD has partnered with TSMC to manufacture its EPYC "Venice" on the 2 nm N2 process, alongside the CoWoS packaging that TSMC's facilities offer. …
TSMC's 2 nm Node Gains Momentum with Fourfold Increase in Tape-Outs
Thursday, July 16th 2026 TSMC's 2 nm Node Gains Momentum with Fourfold Increase in Tape-Outs by AleksandarK Yesterday, 18:12 Discuss 2 Comments TSMC's 2 nm node has reportedly attracted significant client attention, as the company's Senior Vice President, Kevin Zhang, confirmed that the N2 node has… …
TSMC Reports Record Q1 Profits for Arizona Fab
Monday, May 18th 2026 TSMC Reports Record Q1 Profits for Arizona Fab by TheLostSwede Today, 13:32 Discuss 5 Comments According to news out of Taiwan, TSMC has had higher profits during the first quarter of this year, compared to all of 2025 from Fab 21 in Arizona. …
Intel's EMIB-T to Rival TSMC's CoWoS with 50% Cost Advantage, Volume Production in 2027
… Intel is attempting to lure customers a way from TSMC with better packaging technology. TSMC reportedly faced issues with the CoWoS-L design for NVIDIA's "Vera Rubin." NVIDIA planned to use CoWoS-L for the design and concept that "Rubin Ultra" was based on. …
NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing
… TSMC is using the NVIDIA Metropolis platform and NVIDIA TAO Toolkit to improve advanced defect classification. Using vision AI, TSMC has improved detection of defects at nanometer scale. …
AMD "Zen 7" IP to Use TSMC A14 Node and More Advanced Packaging
… According to Taiwanese media outlet Commercial Times, AMD is reportedly considering TSMC's A14 node, officially utilizing the first angstrom-era node for its products. …