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… The announcement further underlines AMD’s continued reliance on TSMC for both advanced process nodes and packaging technologies. AMD references TSMC SoIC-X and CoWoS-L as part of its broader AI and data center portfolio. …
… The use of TSMC N2P for the standard CCD is also notable. N2P is expected to be an optimized derivative of TSMC’s base N2 process, providing improvements in power efficiency and performance characteristics while remaining within the broader 2 nm manufacturing family. …
… As AMD transitioned through subsequent Ryzen generations, TSMC introduced updated wafer stacking and bonding processes. …