… TSMC's Advanced Packaging Supply Constraints Force the Firm to Rapidly Add New Capacity, or Risk Losing Customers We have discussed advanced packaging AP bottlenecks extensively on the website, but it is important to note that without adding new capacity, there is no other way to solve this bottlen… …
… ABF is one of the more 'quieter' elements in short supply in the AI supply chain, but we highlighted it specifically here because it is proving to be one of the bigger bottlenecks in scaling the advanced packaging supply. …
Intel's packaging services are being considered a viable alternative to TSMC's CoWoS, as supply constraints are forcing US fabless customers to seek other options. …
… Intel & Samsung Emerge As Potential Fix To Apple's Supply Constraints Affecting Its Consumer Chips Bloomberg has just dropped some big news surrounding Apple, which is in early talks with Intel and Apple to secure additional supply for its consumer lineup. …
… The next issue pertains to packaging constraints. …
… The details suggest that a 4-chip variant of the Rubin chip could use Intel's EMIB-T packaging process instead and provide the chip manufacturer with an important role in NVIDIA's and the artificial intelligence supply chain. …
… This shift underscores how supply chain constraints stemming from AI companies' supply squeezes are forcing even industry leaders like Apple to scale back ambitious hardware plans. …
… Read all comments on Intel’s ZAM Memory Threatens HBM’s AI Throne With 2x The Bandwidth of HBM4, More Capacity & Low Thermal Constraints
… Intel already possesses the advanced packaging technologies needed for this type of implementation. The company’s EMIB and Foveros 3D packaging technologies allow multiple dies and memory components to be integrated into compact multi-chip modules with high-speed internal interconnects. …
… TSMC's CoWoS technology has been widely used with SK hynix's HBM modules in the past; however, not only does the firm face supply constraints with 2.5D packaging, but for its facilities in the US, accessing advanced packaging domestically isn't currently possible. …