LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput
…Yet, to establish a position, LG plans to price its LDI system competitively. Another way to pattern substrates There are many ways to pattern substrates, including photolithography, e-beam lithography, nanoimprint lithography…