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Hard to say. Neither Intel nor Tesla has filed any paperwork with the US Securities and Exchange Commission, which is typically required if a new partnership or deal materially changes the capital investment or manufacturing capacity of a public company. For example, when chipmaker AMD and Meta announced a “multiyear, multi-generation” partnership in February to deploy up to 6 gigawatts of AMD GPUs for Meta’s AI services, AMD disclosed the deal in an SEC filing. As of publishing, no such forms have been filed yet by Intel or Tesla. That indicates Tan and Musk’s agreement may be mostly handshak

Intel’s public statement about the mash-up with Musk is almost comically vague. The company said that its “ability to design, fabricate, and package ultrahigh-performance chips at scale” will help accelerate Terafab’s goal of producing 1 terawatt of computing power a year to support “future advances in AI and robotics.” Pat Moorhead, a longtime chip-industry analyst and founder of Moor Insights & Strategy, predicts that Musk will lean on Intel for its advanced packaging capabilities to start. He notes that Tesla “doesn’t need [chip] design engineering; they’re already very capable of that.” Mo

Tesla’s track record on chips suggests that the answer will be a lot. Last year, Tesla signed a $16.5 billion deal with Samsung to produce the automaker’s next-generation A16 chip at its factory in Texas. But Tesla designed the chip itself, to ensure it was tailored to the company’s line of autonomous vehicles and humanoid robots, and, according to Musk, “Samsung agreed to allow Tesla to assist in maximizing manufacturing efficiency.” “This is a critical point, as I will walk the line personally to accelerate the pace of progress. And the fab is conveniently located not far from my house,” Mus