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What is HBM?

HBM is the DRAM industry’s attempt to short-circuit the slowing pace of Moore’s Law by using 3D chip-packaging technology. Each HBM chip is made up of as many as 12 thinned-down DRAM chips called dies. Each die contains a number of vertical connections called through-silicon vias. The dies are piled atop each other and connected by arrays of microscopic solder balls aligned to the TSVs. This DRAM tower—well, at about 750 micrometers thick, it’s more of a brutalist office block than a tower—is then stacked atop what’s called the base die, which shuttles bits between the memory dies and the proc

How Will the Tech Industry Handle the DRAM Shortage?
Why Not Just Reduce Memory Further?

Many readers are doubtless salivating at the idea of spending less on HBM and are thinking: Why not curtail the amount of memory in a system even further? If a typical prefill sequence length means a memory utilization of low double digits or even single digits - why not reduce memory capacity to 1/10th the size? Does this mean doom for HBM demand and memory demand in general? However, things are not so simple in technology. What Rubin CPX does is reduce the cost of pre-fill and tokens. Lower cost of tokens increases demand, which means more demand for decode increases as well. Like many other

Another Giant Leap: The Rubin CPX Specialized Accelerator & Rack