China's domestic memory manufacturers are rushing to produce HBM chips, but the biggest DRAM maker has run into roadblocks with HBM3 tech. CXMT Is Reportedly Struggling With Its HBM3 Development & Has…
…This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions. The company's mass-production capabilities also…
…VCS), the manufacturer can ensure that HBM chips thrive in mobile devices despite the size constraints by stacking DRAM dies in a “staircase” configuration and filling the gaps with copper pillars. The…
…After the ruling, Samsung HBM still made it into China. We previously detailed how companies like CoAsia Electronics and Faraday supplied non-functional chips with HBM into China, though we believe due…
…The most popular memory today is on-chip HBM which strikes the balance between capacity and bandwidth. HBM combines vertically stacked DRAM chips with ultra-wide data paths and has the optimal…
…TSMC’s 2.5D packaging technology that places a chip on a wafer and then connects it to a substrate. By arranging logic chips and HBM side by side on a single…
Samsung holds desperate final talks with union over 18-day chip factory strike that could cost $20 billion — government-mediated summit seeks to avert industrial action that could hit HBM production
…Mainstream firms responsible for DRAM production, such as Samsung, SK hynix, and Micron, have shifted their focus towards HBM by converting existing production lines and scaling up process technology, which is currently…
…other as HBM does. Today, NEO Semiconductor has demonstrated the 3D X-DRAM Proof-of-Concept and also secured investments to further advance the project. With the POC test chips, the company…
…That has led to a big need for LPDDR5 and LPDDR5X memory, especially SOCAMM2 . With HBF's multi-layered stacking approach, chip makers and AI ecosystem providers can not just reduce PCB…
