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SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing

…Such methods allow for increased transistor density, but at the cost of increased process complexity, cost, yield risks, and design constraints. Did China just beat Intel? - YouTube Watch On Meanwhile, transistor density…

Jul 21, 2026 · Anton Shilov