ASRock Rolls Out AGESA BIOS 1.2.7.1 To Improve "Compatibility" With Upcoming AMD CPUs
The motherboard vendor is ready to offer improved compatibility with AMD's upcoming CPUs, but it hasn't stated which CPUs these are. …
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AIDA64 Goes Big on AMD Zen 6 Support With The Addition of Mustang Peak, Olympic Ridge, Medusa & Venice Lineups, Also Brings ACE x86 Readiness
… His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking. …
Crimson Desert to Get Difficulty Settings, Boss Rematches, and More in Upcoming Updates
… User interface improvements to the map, inventory, and housing are being worked on, too. …
Samsung Bringing Refined Hole-Punch Tech And Special Refractive Lenses To The Galaxy Z Fold 8 To Improve Its Aesthetics
Samsung is bringing some material, albeit still-iterative, improvements to the upcoming Galaxy Z Fold 8, especially in relation to its punch-hole aesthetics. …
NVIDIA's Upcoming N1x SoC Fails To Match Apple's 2023-Launching M3 Max Chip In Pre-Release Geekbench 6 Scores
… Read all comments on NVIDIA’s Upcoming N1x SoC Fails To Match Apple’s 2023-Launching M3 Max Chip In Pre-Release Geekbench 6 Scores
TSMC's A16 '1.6nm' Node Promises 10% Speed Boost or 20% Power Cut Over 2nm, With Backside Power Hitting Production by Q4 2026
… In terms of improvements besides the area shrink, the A13 node also offers full backward compatibility with A14. …
SK hynix Delivers Next-Gen Memory Solutions: 48 GB HBM4 at 11.7 Gbps Speeds, SOCAMM2 & LPDDR6 For Upcoming AI Platforms
… His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking. …
Huawei’s Kirin 9050 Is Rumored To Outperform Apple’s A18 Pro, Will Utilize A New “Stacking” Technology To Bypass Older Node Limitations
… New packaging technology will enable the Kirin 9050 to stack components vertically to increase transistor density and performance Analyst Yu Fangbo of CITIC Securities has made a bold claim surrounding Huawei’s upcoming flagship SoC, the Kirin 9050, which will likely power the upcoming Mate 90 seri… …
Samsung Exynos 2700's New Architecture Set to Extend Thermal Lead Over Snapdragon, Unlock A 30-40% Jump In Memory Bandwidth
… What's more, the HPB heat sink can then sit on top of the SoC and the RAM, resulting in material improvements to the chip's thermal stability. …
Intel Claims Panther Lake CPU Lineup Will Show The 'Most Refined' Hybrid P-Core/E-Core Setup, Building Upon Lunar Lake But With Massive Improvements
One of the major improvements with Intel's upcoming Panther Lake lineup is its hybrid architecture, which is expected to offer significant upgrades over Lunar Lake. …