Samsung Q1 2026 Earnings: Conventional DRAM More Profitable Than HBM Right Now
… Samsung is planning to deliver some of the first samples of its HBM4e product shortly. …
… Samsung is planning to deliver some of the first samples of its HBM4e product shortly. …
… Samsung's HBM4 Modules Are Claimed to Be at a 90% Logic Yield, Making Mass Production Inevitable HBM4 is one of the most 'prestigious' computing essentials in the modern-day markets, mainly since the memory module will be responsible for scaling up AI performance. …
… The new standards offer more than just speed improvements, with the highlights listed below: Related Story Micron Warns Memory Crunch Will Outlast 2026 as AI Demand Outpaces What HBM, DRAM and NAND Can Supply 10nm-class DRAM Process Tech 1c 4nm Logic Process 11.7-13.0 Gbps Pin speeds 3.3 TB/s Bandw… …
… It would not be incorrect to say that NVIDIA's AI pursuit is one of the primary reasons for the memory shortages in the first place, given that the company has acquired general-purpose DRAM LPDDR, SO-DIMM, GDDR , along with HBM supply, to fuel the race for AI infrastructure. …
… SK hynix has successfully supplied optimized memory solutions to customers based on its expertise in the mass production and supply of HBM3, HBM3E, and HBM4. …
… Going forward in 2026, the Memory Business will focus on the mass production of HBM4 products with differentiated performance, while simultaneously aiming to scale out the HBM sales base. …
… Samsung HBM4E Memory Is Ready For NVIDIA's Rubin Ultra Platform: Up To 4 TB/s Bandwidth, & 48 GB Capacity Samsung's HBM4E Memory has been showcased at GTC 2026, offering some really fast speeds such as 16 Gbps for IO, providing up to 4 TB/s bandwidth per stack, and 16-Hi stacks for a per-stack memo… …
… Related Story Intel Crescent Island “Xe3P” GPU Scales To 480 GB of “Cost-Optimized” LPDDR5X Memory, Beating NVIDIA Rubin & AMD MI450X With Highest Capacity This move was made as the company wants to pool in more capacity towards the more profitable and more relevant memory technologies such as LPDD… …
… Similarly, given that with agentic AI, memory bandwidth is a critical bottleneck, manufacturers are rushing to integrate superior HBM technologies, SOCAMM modules and much more, which shows that the above-mentioned DRAM capacity increase would directly address the rise in demand from the AI sector. …
… For a quick recap, most demand comes from data centers seeking to leverage DRAM for HBM as well as DDR modules to maximize memory latency in their configurations. …