… Can we see a future where Intel's EMIB technology gets used by OpenAI for the creation of its custom AI chips with many chiplets and large amounts of HBM memory? …
… Related Story Another Chinese DRAM Maker Breaks Into DDR5 Memory, Mass Producing 64GB RDIMMs as Samsung and SK Hynix Run Dry The move by the state-backed chipmaker underscores China's growing urgency to boost its capability to manufacture advanced chips after the U.S. expanded export controls in De… …
… While HBM memory chips are typically considered in the context of enterprise computing and workloads, hybrid bonding can create advantages for consumers as well through performance improvement. …
… Primarily, the tightness can be attributed to the decreasing rate of performance gain with subsequent generations of memory chips and the larger die sizes of newer HBM chips. …
… Global DRAM vendors are already rushing into mass production for HBM4 memory, and are ramping up HBM3E solutions for next-gen AI Datacenters. HBM4 will play a key role in upcoming datacenter chips such as NVIDIA's Vera Rubin and AMD's MI400, both expected to land later this year. …
… Also, given how expensive mobile DRAM has become, we believe that smartphone companies will only begin brainstorming the feasibility of HBM chips in their devices when prices stabilize. …
… The DRAM industry would be interesting to watch moving forward, especially since technologies like HBM4 would further scale up the production required. Big Tech craves HBM right now, and the only way to move forward is by increasing the supply. …
… With the POC test chips, the company has demonstrated that 3D X-DRAM can be manufactured using existing 3D NAND infrastructure, adding multiple layers of DRAM instead of a stack like HBM memory. …
… While HBM offers 32-64 GB capacities per stack right now, HBF will scale up to 4 TB capacities . As for speeds, HBM is faster, but with architectural optimizations, HBF will be able to provide enough throughput for critical AI tasks. …
… However, given that when you factor in the state of the Chinese HBM industry, CXMT's HBM3 technology would be a significant breakthrough, one that could allow Huawei to scale up production of its Ascend chips. …