… SK hynix Plans to Invest Up to $13 Billion into Advanced Packaging Lines in South Korea, Alongside Its M15X Fab Advanced packaging is emerging as one of the significant bottlenecks in the AI supply chain, as companies have based their chip portfolios on this technology, and current production lines… …
… Related Story NVIDIA’s Nemotron 3 Super Tops The Open-Source AI Model Chart, Beating DeepSeek & GPT-OSS UAE states that a large portion of these investments will be aimed at accelerating their cooperation in advanced technology and AI. …
… Since TSMC is being hammered due to supply constraints, vendors have started to diversify their chip-making plans. Based on our assessment, to meet the strong demand in AI applications, we are stepping up our CapEx investment to increase our N3 capacity. …
… Related Story V-Color’s New OC RDIMM Smashes The 9600 MT/s Barrier On Intel’s W890 Platform, While Sipping Just 1.1V At 8000 MT/s We'll talk about Micron first, given that, at least on paper, the firm has the largest capital investment plans. …
… TSMC's Arizona Is Expected To Turn Out To Be a Taiwan-Level Fab Network, Driven by Gigantic Investments The Taiwan chip giant has managed to pivot towards America's semiconductor industry, and several factors have influenced this shift, which we'll discuss later. …
SK hynix, the Korean memory giant, now plans to establish a U.S. "AI solutions" firm, interestingly called "The AI Company", intending to take DC opportunities to new heights. …
… Team Blue has already hinted at this in its latest blog post, and the company plans to build "heterogeneous" AI data centers with Intel GPUs, CPUs, and SambaNova systems. …
The growth in agentic AI software will lead to high demand for CPUs in the AI era, believes investment bank UBS. In an investment note, the bank explains that agentic AI increases the workload for processors. …
… For the first half of 2026, Anthropic will secure up to 5GW of compute capacity for training and deploying Claude. These will mainly include Amazon's Trainium2 capacity. Anthropic will further install an additional 1GW capacity featuring both Trainium2 and Trainium3 chips by the end of 2026. …
Intel has placed a massive order at Taiwanese manufacturers to secure advanced packaging equipment, which will be used for its EMIB plans. …
