…Related Story Samsung Leapfrogs Toward 1000-Layer NAND With First 900-Layer V-NAND Prototype, Stacking Two 450-Layer Cells Into One Amidst this changing environment, SK Hynix has decided to invest…
…His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e…
…Intel's GPU roadmap has been a bit confusing lately. The company initially had Xe2 as Battlemage, Xe3 as Celestial, and Xe4 as Druid, with a next-gen Xe using the "Elasti…
…His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e…
…Nova Lake is expected to feature up to 52 cores, new Xe3P Arc iGPUs, and also feature brand new architecture and software changes. In addition, and just as important, the group will…
…In the event of an update to the model itself, these changes are reflected in storage devices, such as SSDs. Phison is reporting a 'tight market' supply, and the increase in NAND…
…One important thing to note is that the CPU is at A0 stepping, meaning that the chip is probably an engineering sample, and there may be some changes before final production. The…
…His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e…
…At the same time, the changes within rack architectures, whether it is modularity, liquid-cooling, advanced power delivery systems, and several others, have forced server manufacturers to invest heavily into R&D…
…Terafab represents a step change in how silicon logic, memory and packaging will get built in the future. Intel is proud to be a partner and work closely with Elon on this…