Work on Next-Gen HBM5 & HBM6 Memory Is Already Underway, New Wide TC Bonders Ready
…80 GB Package Power per HBM: 100W Packaging Method: Microbump (MR-MUF) Cooling Method: Immersion Cooling, Thermal Via (TTV), Thermal Bonding Dedicated decoupling capacitor chip die stack Custom HBM Base Die w…