…Intel-Partner, Amkor, Says Glass Substrates Will See First Commercialization Within Three Years Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet…
…This siloed approach would allow Apple to keep the overall design of the AI ASIC hidden even from its partners like Broadcom. Coming back, the fact that Apple has procured T-glass…
…As per earlier reports, Intel and NVIDIA will first of all work on a custom Xeon CPU for data centers with NVIDIA's NVLink integration , while on the consumer front, we will…
…TSMC (covered by Charlie Chan) is expanding its SoIC (System on Integrated Circuit) capacity, with Apple placing orders equivalent to 36K wafers in CY26 and 60K wafers in CY27." According to the…
…Partnered with global industrial software leaders to accelerate AI-driven design, engineering, and manufacturing using NVIDIA CUDA-X, NVIDIA Omniverse, and accelerated computing. Announced collaboration with T-Mobile and Nokia to integrate…
…Still, one of the major partnerships that the company entered into was with Groq, a non-licensing agreement worth up to $20 billion, which is Team Green's biggest investment. The announcement…
…Technologies like CoWoS enable firms like NVIDIA/AMD to integrate HBM modules directly onto the main compute die. This is why, for memory manufacturers like SK hynix, having sufficient advanced packaging capacity…
…ARM CEO Says Their Newest AGI CPU Won't "Piss Off" Partners Like NVIDIA, But Will Be Troublesome For Intel/AMD ARM made a rather unusual announcement at its recent keynote, where…
Intel is now looking to capitalize on the ongoing DRAM demand by partnering with a SoftBank subsidiary to launch a new "ZAM" memory technology. Intel's ZAM Memory Modules Now Bring In…
…Some board partners may sell the card via system integrators only, as we previously saw XFX mentioning on the official website . As far as the specs go, the Radeon AI Pro R9700…