…A 14-reticle size CoWoS die solution, which can integrate 10 compute dies and 20 HBM stacks, is already slated for production by 2028. The company will further expand its capabilities in…
…Intel has yet to roll out its first 18A products, which are expected to arrive later this year with Panther Lake, & ramp is expected in early 2026. With that said, Intel is…
…We remain fully committed to the development, production, and support of our high-performance hardware. Our product roadmap continues as planned, and our commitment to delivering cutting-edge technology to gamers and…
Samsung's innovative streak is very much alive and kicking, as evidenced by a litany of its upcoming novel products, which now include the Galaxy Z Roll as well as holographic and…
…has long opposed integrating core technologies into computing products sourced from Chinese vendors. Examples of it span AI and networking infrastructure, meaning that even if a prospect for Chinese memory suppliers opens…
…Simplifies out-of-band manageability and disaster recovery through first and only fully managed, turnkey Software-as-a-Service (SaaS)-based activation and first silicon partner integrated with Microsoft Intune - eliminating the…
…product stack, as the entire lineup brings 8-core SKUs and is aimed at premium lightweight devices, bringing a long battery life. The difference mostly lies in the clock speeds and integrated…
Gigabyte has listed an unannounced AMD Ryzen 5 5700 APU based on the "Cezanne" silicon which doesn't feature an integrated GPU. AMD Ryzen 7 5700 APU Features 8 Zen 3 Cores…
…Ultra's design adjustment is not weakening demand or product downgrading, but rather a reconfiguration of the architecture from highly packaged integration to board-level assembly. Dual-die chiplet designs were introduced…
…Based on a survey conducted by IDC across more than 500 IT and businesses across various regions, it was discovered that AI PCs are being rapidly adopted and are being integrated into…
