Exynos 2700 To Receive Premium Treatment From Samsung As Update Drops Claims Of Company Abandoning Its 2nm SoC’s Advanced Packaging
…Highly Likely - Multiple reliable sources RUMOR ASSESSMENT 50% Plausible Samsung was considering removing Fan-Out Wafer-Level Packaging (FOWLP) from the Exynos 2700 as part of its cost-cutting strategy to make…