SK hynix's Roadmap Positions HBM5/HBM5E, GDDR7-Next, DDR6 & 400+ Layer 4D NAND In 2029-2031
…developing “AI-D B (Breakthrough)”, a solution featuring ultra-high-capacity memory with flexible memory allocation. Finally, from the perspective of expanding applications, it is preparing “AI-D E (Expansion)” to extend…