Leaked Intel Nova Lake-S image confirms new LGA-1954 socket and a notch placement that kills backward compatibility
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Leak: AMD Zen 6 'Powderhorn' B0 silicon tapes out - Targeting late 2026 to rival Intel's Nova Lake
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Huawei produces 122TB SSDs using proprietary packaging to work around US semiconductor restrictions
… Rather than accepting the capacity disadvantage of existing TSOP or BGA packaging, Huawei focused on board-level packaging innovation to improve capacity density by enabling tighter NAND integration. DoB is a wafer-level packaging technology that mounts semiconductor dies directly onto a base PCB. …
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… 16 Next » Latest News Huawei produces 122TB SSDs using proprietary packaging to work around US semiconductor restrictions Valorant's Vanguard anti-cheat now destroys DMA cheat firmware Leak: Intel Hammer Lake brings 'Thunder Hawk' unified cores to desktop, also revives multithreading AMD confirms p… …
NVIDIA's Rubin Ultra reportedly sticking to a dual-die design instead of a four-die plan
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Intel leak details upcoming Core Ultra 400 Series desktop CPUs, including a 52-core model
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Motherboard News – AMD, Intel, Chipsets, BIOS Updates & More
🎉 Giveaway: Win a Lian Li O11 Vision-M and HydroShift II OLED Curved 360TL Builders Package TweakTown News Motherboards Get the latest motherboard news, including AMD and Intel boards, new chipset launches, BIOS/UEFI updates, and upcoming motherboard releases. …
Leak: Intel Hammer Lake brings 'Thunder Hawk' unified cores to desktop, also revives multithreading
… Similar News Stories Intel's next-gen Titan Lake CPUs rumored with 'Unified Core' that combines P-Cores, E-Cores AMD Ryzen 200 'Hawk Point Refresh' APU tease: fights Intel Core 200 'Raptor Lake Refresh' CPUs Leak: Intel Razor Lake packs up to 52 cores, but most mobile chips may reuse Nova Lake sili… …
Intel officially launches Xeon 6+ 'Clearwater Forest' CPUs, up to 288 cores, built on Intel 18A
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Google taps MediaTek to build its next Triggerfish TPU chip launching in 2027
… Humufish is also expected to use Intel's EMIB packaging rather than TSMC's CoWoS, with Intel handling packaging while TSMC manufactures the compute die. Reports of a three-million-unit Intel Foundry order for Google TPUs appear to refer to packaging rather than full wafer production. …