Leaked Intel Nova Lake-S image confirms new LGA-1954 socket and a notch placement that kills backward compatibility
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… 25 Once the motherboard cover plate is removed, the case reveals full support for BTF Back To Future, reverse-connector, meaning connectors are on the rear side of the motherboard for cleaner cable management motherboards. …
… Rather than accepting the capacity disadvantage of existing TSOP or BGA packaging, Huawei focused on board-level packaging innovation to improve capacity density by enabling tighter NAND integration. DoB is a wafer-level packaging technology that mounts semiconductor dies directly onto a base PCB. …
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