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The patent describes a vaporization-based system that uses advanced heat pipes with tapered sections and a more traditional, water-like liquid that vaporizes to carry heat, versus the PS5’s use of liquid metal as a thermal interface. Unlike liquid metal, the patented design is described as working effectively in both horizontal and vertical orientations and is intended to avoid the complex assembly and leak-related component damage that plagued the PS5’s liquid metal solution. Answered
PlayStation 6 will reportedly ditch the PS5's liquid metal cooling in favor of something elseThe SR700 can accommodate up to 30 x 120mm fans and supports two 480mm radiators. These details come from CPS PCCOOLER's SR700 High-end AI workstation chassis description. Answered
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