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Showing top 104 results for "new product capabilities"

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tomshardware.com › pc-components › cpus

Computex 2026 Day One Wrap-Up: Arm makes a bold play for Windows PCs, PCIe 6.0 SSDs are coming, Asus embraces black and gold for ROG 20th

… Here’s everything else we’ve covered for Computex 2026 Day One: Noctua announces new thermal pad for AMD chips in partnership with Carbice Gigabyte debuts fourth-gen Tandem WOLED and multi-mode Mini LED gaming monitors Gigabyte showcases new Infinity products for its 40th anniversary Cooler Master … …

Jun 2, 2026 · Brandon Hill
tomshardware.com › tech-industry › artificial-intelligence

Anthropic's Claude hacked three real-life companies during security capabilities test — test environment with internet access and unwitting targets' lax cybersecurity practices led to bots running rampant

Whether driven by a desire for transparency or to keep OpenAI from hogging the spotlight when it comes to advertising advanced AI models, Anthropic revealed that Claude also hacked into three production systems belonging to unsuspecting targets during cybersecurity capabilities testing. …

Aug 1, 2026 · Bruno Ferreira
tomshardware.com › tech-industry › artificial-intelligence

Claude Fable 5 brings Mythos to the masses — Anthropic's new frontier model is 'state-of-the-art on nearly all tested benchmarks'

Ever since Anthropic first made the earth-shaking disclosure of its incredibly capable Claude Mythos AI model back in April and the steps it was taking toward a safe release of that product, the AI public has been waiting with bated breath to get its hands on its capabilities to give them a spin. …

Jun 9, 2026 · Jeffrey Kampman
tomshardware.com › tech-industry › semiconductors

Tesla hires 17-year Intel veteran responsible for billion-dollar fab startups — Gary Jiang likely chosen to oversee fab efforts for Terafab's licensing of 14A

… Jiang's skills roughly match what one would expect from a senior manufacturing executive helping commission a new leading-edge fab, so he will be instrumental in turning a newly constructed fab shell or even cleanroom into a production-ready semiconductor manufacturing facility. …

Jul 1, 2026 · Anton Shilov
tomshardware.com › tech-industry › semiconductors

TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package

… However, keeping in mind that CoPoS uses new tools and since the peculiarities of these tools are unknown, it is more reasonable to expect the first CoPoS-based products in 2029 or 2030, with more meaningful volumes sometime in the first half of the next decade. …

Jun 16, 2026 · Anton Shilov