Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs
Researchers in Korea and Japan have presented two separate memory-integration proposals that aim to increase HBM High-Bandwidth Memory capacity and bandwidth without trapping more heat inside ever-taller DRAM Dynamic Random Access Memory stacks, one of the most pressing challenges facing future AI … …