Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer
… The n-channel devices use molybdenum disulfide MoS 2 , while the p-channel devices use tungsten diselenide WSe 2 or tungsten disulfide WS 2 . …