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Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management

… "No single company can independently find all the answers along the path of semiconductor evolution," He Tingbo, chairwoman of the Huawei Scientist Committee and president of the company's semiconductor business department, said at a media briefing on Monday. …

May 28, 2026 · Luke James