SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers
… Unlike conventional memory, HBM achieves massive bandwidth by vertically stacking multiple DRAM dies, dramatically shortening the distance data must travel and enabling far higher transfer speeds with better power efficiency. …
