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Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines

… With several advancements in the physics side of quantum computing, manufacturing now represents the major limitation. …

May 25, 2026 · Etiido Uko

China's next-gen CPUs and GPUs prepare to challenge last-gen Intel and AMD in 2027 — Loongson 3B6600 and 9A1000 aim to match Intel's 12th Gen and AMD's RX 550

… Although the 3B6600 and 9A1000 cannot hold a candle next to the best CPUs for gaming or best graphics cards , they reportedly achieve performance parity with Intel’s 12th Generation Alder Lake processors and AMD’s Radeon RX 550 graphics card, respectively. …

May 12, 2026 · Zhiye Liu

Electronics Manufacturing News, Analysis and Features | Tom's Hardware

… Semiconductors Premium TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking. …

May 11, 2026

Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond

… Swipe to scroll horizontally Row 0 - Cell 0 18A vs 3 18A vs 20A 18A-P vs 18A 14A vs 18A 14A-E vs 14A Power 15% perf. per watt 10% perf. per watt 18% 25% - 35% lower Performance 15% perf. per watt 10% perf. per watt 9% 15% - 20% higher Density 1.3X slightly higher - 1.3X higher Transistor RibbonFET … …

May 14, 2026 · Anton Shilov

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

… The company believes that structurally preventing thermal throttling will enable next-generation memory layers targeted for future generations like HBM5 to scale to higher stack heights and sustain maximum data transfer speeds under the heavy computational loads of AI data centers. “iHBM is the opt… …

May 26, 2026 · Etiido Uko

Why now is the best time to jump on the OLED monitor bandwagon — breaking down new-gen panel tech and our top burn-in prevention tips

… The company recently announced at SID Display Week 2026 that it is launching 3rd generation Tandem OLED panel technology. LG’s development in this space has come at a rapid clip, as the company only announced its 2nd generation Tandem OLED technology back at CES 2026. …

May 18, 2026 · Brandon Hill

Japanese chemical giant JSR expands to Taiwan for EUV photoresist production near TSMC — plant to fill missing chemical link to scale EUV materials

… JSR's MOR production plant in Cheongju, South Korea, built through its JSR Micro Korea subsidiary, is expected to begin mass production this year, supplying Samsung Electronics and SK hynix with tin-based MOR for EUV layers in next-gen DRAM. …

May 13, 2026 · Luke James

Cooler Master is bringing active cooling to DDR5 RAM, promising up to 15-degree temperature drops — 'MasterDIMM' combines G.SKILL memory with a built-in fan, kits run up to 128GB

… There are no pricing or availability details yet, but it's not hard to imagine these kits, made for "demanding next-gen systems," will be even pricier than regular DDR5. …

May 29, 2026 · Hassam Nasir

Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing strategies and IP

… UMC dominates small-panel display driver IC DDIC production at 28nm, holding over 90% market share in that segment, and launched an advanced 22nm embedded high-voltage eHV platform in 2024, targeting next-generation smartphone OLED displays. …

May 28, 2026 · Luke James

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Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines

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