Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
… Intel has said EMIB-T supports HBM3, HBM3E, HBM4, and future HBM5 stacks and scales to a 120mm x 180mm package carrying more than 38 bridges and over 12 reticle-sized dies. …