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Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration

… Intel has said EMIB-T supports HBM3, HBM3E, HBM4, and future HBM5 stacks and scales to a 120mm x 180mm package carrying more than 38 bridges and over 12 reticle-sized dies. …

Jun 10, 2026 · Luke James

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All content Archive | May 2026 | Tom's Hardware

…source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers Uber chief warns no link yet between AI tokenmaxxing and…

tomshardware.com › uk › archive › …

All content Archive | May 2026 | Tom's Hardware

…source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers Uber chief warns no link yet between AI tokenmaxxing and…