… Last year, a roadmap from KAIST projected HBM5 reaching a 4,096-bit interface, roughly 4 TB/s per stack, and about 100 watts of per-stack power, a thermal load that goes a long way in explaining why both Korean memory giants are reworking their packaging now rather than at launch. …
…chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration By Luke James Published 11 May 26 Semiconductors Portable 40mm launcher kills drones by firing…
…and even conflicts' By Luke James Published 16 May 26 Semiconductors Premium Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond By Anton…
… Enter: the new XPS 14 Samsung holds desperate final talks with union over 18-day chip factory strike that could cost $20 billion — government-mediated summit seeks to avert industrial action that could hit HBM production The tech industry is moving faster than ever. …
… Enter: the new XPS 14 Samsung holds desperate final talks with union over 18-day chip factory strike that could cost $20 billion — government-mediated summit seeks to avert industrial action that could hit HBM production The tech industry is moving faster than ever. …