Search: HBM memory scaling

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

… The company believes that structurally preventing thermal throttling will enable next-generation memory layers targeted for future generations like HBM5 to scale to higher stack heights and sustain maximum data transfer speeds under the heavy computational loads of AI data centers. “iHBM is the opt… …

May 26, 2026 · Etiido Uko

Micron's Virginia fab begins producing America's most advanced DRAM memory — fab expansion to quadruple output, easing DDR4 shortage for automotive and defense sectors

… Micron is scaling up DDR4 production as the supply of the older memory standard has become unexpectedly tight. All three major DRAM producers are reallocating fab capacity toward DDR5, LPDDR5X, and high bandwidth memory HBM to meet AI-driven demand from hyperscalers and data center operators. …

May 23, 2026 · Luke James

The custom AI ASIC state of play (May 2026) — Broadcom deals, Google TPUs, Meta MTIA & beyond

… Each Trainium3 delivers 2.517 PFLOPS FP8 with 144GB HBM3E at 4.9 TB/s bandwidth , roughly double the compute and 1.5 times the memory of its predecessor. The new Trn3 UltraServer packs 144 chips delivering 362 FP8 petaflops with 20.7 TB of memory, a 4.4 times improvement over Trn2 UltraServers. …

May 21, 2026 · Luke James

China bypasses US GPU bans with 1.54-exaflops 'LineShine' supercomputer — CPU-only monster packs 2.4 million Huawei-designed Armv9 cores

… Each chiplet contains four HBM domains and four DDR domains; there are 16 NUMA domains per processor. HBM access is highly sensitive to locality, whereas DDR memory access is more uniform within a die and is shared between clusters. …

May 17, 2026 · Anton Shilov

Record-high pricing pushes SSD and memory makers to borrow $880 million just to afford buying chips — Adata, TeamGroup, and others take on substantial debt to survive shortages

… Go deeper with TH Premium: Memory AI data centers are swallowing the world's memory and storage supply The future of DRAM: From DDR5 to future ICs High-bandwidth memory roadmap Here's why HBM is coming for your PC's RAM Adata is the largest single borrower in the group, having completed a NT$2 bill… …

May 18, 2026 · Luke James

The rise of local agentic computing faces a brutal reality: rising DRAM prices — RTX Spark, Gorgon Halo chips subject to 63% DRAM contract price hike this quarter

… DRAM supply squeeze The local AI PC has become a category defined by how much memory it carries, and it’s scaling that memory up at a time when memory has never cost more. …

Jun 3, 2026 · Luke James

China's next-gen CPUs and GPUs prepare to challenge last-gen Intel and AMD in 2027 — Loongson 3B6600 and 9A1000 aim to match Intel's 12th Gen and AMD's RX 550

… To accelerate its progress, Loongson has seemingly established partnerships with other companies to co-develop logic silicon wafers for High Bandwidth Memory HBM chips. …

May 12, 2026 · Zhiye Liu

AMD begins production ramp of 256-core EPYC Venice — first 2nm HPC chip claims 70% performance leap

… Tom's Hardware Premium Roadmaps High-Bandwidth Memory HBM Roadmap Nvidia Enterprise GPU and CPU Roadmap AI accelerator Roadmap Desktop GPU Roadmap 3D NAND Roadmap TSMC began volume production on its N2 node late last year, and the foundry is ramping five separate 2nm fabs this year to meet what it … …

May 21, 2026 · Luke James

AMD announces MI350P PCIe AI accelerator card with 144GB of HBM3E — roughly 40% faster in FP16 and FP8 theoretical compute compared to Nvidia's H200 NVL competitor

… Go deeper with TH Premium: Chipmaking A deeper look at the chipmaking supply chain TSMC's $165 billion U.S. investments examined China reportedly reverse-engineers EUV tool China bets on DUV, as EUV blockade reshapes chipmaking Swipe to scroll horizontally AMD MI350X and MI355X specficaitions Speci… …

May 7, 2026 · Aaron Klotz

Tech Industry News, Analysis and Features | Tom's Hardware

…chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration By Luke James Published 11 May 26 Semiconductors Portable 40mm launcher kills drones by firing…

May 12, 2026

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