SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers
… SK hynix says the result is an over 30% reduction in thermal resistance, “ensuring stable operating characteristics even in high-temperature and high-load environments.” Go deeper with TH Premium: Memory AI data centers are swallowing the world's memory and storage supply The future of DRAM: From D… …
