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Showing top 10 results for "Future chip roadmap"

tomshardware.com › tech-industry › semiconductors

Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond

… The world's largest contract chipmaker initiated mass production of chips using its N2 process technology — its first node with GAA nanosheet transistors — at two fabs simultaneously late last year in a bid to meet demand from a wide range of applications, starting from Apple's smartphones and all … …

May 14, 2026 · Anton Shilov

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tomshardware.com › tech-industry › semiconductors

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

… Go deeper with TH Premium: Memory AI data centers are swallowing the world's memory and storage supply The future of DRAM: From DDR5 to future ICs High-bandwidth memory roadmap Here's why HBM is coming for your PC's RAM EMIB connects multiple semiconductor dies using small silicon bridges embedded … …

May 11, 2026 · Luke James
tomshardware.com › tech-industry

Record-high pricing pushes SSD and memory makers to borrow $880 million just to afford buying chips — Adata, TeamGroup, and others take on substantial debt to survive shortages

… Go deeper with TH Premium: Memory AI data centers are swallowing the world's memory and storage supply The future of DRAM: From DDR5 to future ICs High-bandwidth memory roadmap Here's why HBM is coming for your PC's RAM Adata is the largest single borrower in the group, having completed a NT$2 bill… …

May 18, 2026 · Luke James
tomshardware.com › tech-industry

Micron's Virginia fab begins producing America's most advanced DRAM memory — fab expansion to quadruple output, easing DDR4 shortage for automotive and defense sectors

… Go deeper with TH Premium: Memory AI data centers are swallowing the world's memory and storage supply The future of DRAM: From DDR5 to future ICs High-bandwidth memory roadmap Here's why HBM is coming for your PC's RAM The 1α process node , which Micron first brought to volume production at its Ta… …

May 23, 2026 · Luke James
tomshardware.com › tech-industry › semiconductors

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

… SK hynix says the result is an over 30% reduction in thermal resistance, “ensuring stable operating characteristics even in high-temperature and high-load environments.” Go deeper with TH Premium: Memory AI data centers are swallowing the world's memory and storage supply The future of DRAM: From D… …

May 26, 2026 · Etiido Uko

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