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tomshardware.com › tech-industry › semiconductors

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

… To minimize latency and feed AI processors fast enough to avoid bottlenecks, HBM is placed extremely close to the GPU or AI accelerator on the same package, connected through a high-speed silicon interposer. …

May 26, 2026 · Etiido Uko