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Showing top 48 results for "AI chip competition"

tomshardware.com › tech-industry › semiconductors

China’s Huawei to enter South Korean AI chip market with new Atlas SuperPods, clusters pack 8,192 Ascend 950 accelerators per deployment — reportedly challenges Nvidia dominance with 'tripled inference performance' of H20 at one-quarter the cost

… The Ascend 950PR, an inference-focused chip, entered mass production in April, while the Ascend 950DT, designed for AI training workloads, is scheduled for release in the fourth quarter. …

Jul 6, 2026 · Etiido Uko
tomshardware.com › pc-components › cpus

Nvidia touts Vera CPU's single-threaded performance as its agentic AI advantage, reveals next-gen 'Rigel' Arm CPU cores — frames chip as a 'max single-threaded CPU at scale,' not a parallel monster

… In certain approved workloads, the chip put up an impressive showing , nipping at the heels of its Xeon and Epyc x86 competitors. In specific single-threaded scenarios, Vera "absolutely dusted the competition" our words . …

Jul 8, 2026 · Bruno Ferreira
tomshardware.com › pc-components › gpus

AMD announces MI350P PCIe AI accelerator card with 144GB of HBM3E — roughly 40% faster in FP16 and FP8 theoretical compute compared to Nvidia's H200 NVL competitor

… Go deeper with TH Premium: Chipmaking A deeper look at the chipmaking supply chain TSMC's $165 billion U.S. investments examined China reportedly reverse-engineers EUV tool China bets on DUV, as EUV blockade reshapes chipmaking Swipe to scroll horizontally AMD MI350X and MI355X specficaitions Speci… …

May 7, 2026 · Aaron Klotz
tomshardware.com › tech-industry › big-tech

Intel announces McLaren F1 partnership, will battle AMD-powered Mercedes — deal includes chips for aerodynamic analysis, vehicle-dynamics simulation, race strategy analytics, and more

… The chipmaker is now the Official Compute Partner of the McLaren Mastercard Formula 1 Team, Arrow McLaren IndyCar Team, and McLaren F1 Sim Racing Team, according to a press release today. Interestingly, this announcement again pits Intel against its PC chip industry nemesis, AMD. …

May 14, 2026 · Mark Tyson
tomshardware.com › tech-industry › semiconductors

LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput

… While LG's entrance will hardly have any noticeable impact on the market for at least a couple of years, another supplier could eventually add much-needed capacity, increase competition, and give chipmakers and OSATs another source of advanced packaging equipment. …

Aug 21, 2026 · Anton Shilov
tomshardware.com › tech-industry › artificial-intelligence

Huawei-led team claims it post-trained DeepSeek's 1.6-trillion-parameter model — 1,000 Ascend 910C chips used in training

… Back in August, it was reported that DeepSeek couldn’t complete a single successful training run for its R2 model in Ascend chips, even with Huawei engineers on site, blaming unstable performance, slow chip-to-chip interconnects, and gaps in Huawei's CANN software stack, its substitute for Nvidia's… …

Jun 6, 2026 · Luke James