Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
…Synopsys, Cadence, and Siemens EDA command 31%, 30%, and 13% of the global EDA market, respectively, and their combined share within China exceeds 80%, according to EE Times China . The U.S…