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LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput

…Whether LG can establish itself alongside Applied Materials, ORC, or Screen will depend on how its equipment performs in production and whether its emphasis on competitive pricing proves sufficient to persuade more…

Aug 21, 2026 · Anton Shilov