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LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput

…LG is entering an already established direct-imaging market led by KLA, Screen Holdings, Limata, and ORC, but participated in by a dozen manufacturers from Germany, France, Switzerland, Japan, and even China

Aug 21, 2026 · Anton Shilov

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