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LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput

…Yet, to establish a position, LG plans to price its LDI system competitively. Another way to pattern substrates There are many ways to pattern substrates, including photolithography, e-beam lithography, nanoimprint lithography…

Aug 21, 2026 · Anton Shilov