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SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

SK hynix announced iHBM today, a memory heat management technology designed to enhance AI system performance. The thermal packaging solution improves heat dissipation by integrating ICEs (integrated cooling elements) directly into the…

May 26, 2026 · Etiido Uko