…Manufacturers could have accessed JEDEC's first DDR6 draft since 2024, but the draft still lacks concrete specifications such as finalized voltage ranges, signal usage, power envelopes, and pinout design. However, this…
…Samsung Electronics is pursuing a more aggressive one-step pricing approach with sharper increases, while preliminary quotations from SK hynix indicate relatively milder hikes through a gradual price-raising strategy, with final…
…large iGPU suggests a design powered by EMIB and Foveros 3D to interconnect various elements. Finally, the chip is expected to feature a BGA-4326 package with 4,326 pins, similar to…
…a bit more of a challenge for modders but likely reducing the BOM cost and final price of the keyboard itself. An exact launch date has not yet been announced, nor has…
…Hey Flameborn! Today is a big day for us as we are finally able to reveal the release date for Enshrouded 1.0! No padding to the announcement, there's one video…
…to what Apple currently achieves with TSMC's 3 nm process in the M5 SoC. Finally, the Bloomberg report highlights Samsung Foundry as a viable alternative to TSMC with its SF2 2…
…This means that the Windows 11 OS will finally integrate these much-desired changes. Source: Microsoft
…Gen 2 DDR5 MRDIMM raw card designs targeting 12,800 MT/s and MRDIMM Gen 3 module standard development, with the underlying memory interface logic nearing finalization Published: JEDEC has published JESD82…
…in Austin, indicating that the foundry's success in attracting external clients is just beginning. Finally, Intel's product execution is impressive, as the company is experiencing such high demand for its…
…dual 360 mm radiator locations and enough space for up to twelve 120 mm fans. Finally, the Xtreme 450P mid-tower came in at 439 × 454 × 245 mm, has a standard frame…