Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million units of…
…The C Lab series features an integrated sheet-metal frame and a C-shaped suspended exterior structure. The design also supports interchangeable exterior materials and color schemes. The S Lab PC Case…
…The ThinkStation P4 provides a strong balance of performance and value, packing flagship workstation capability in a scalable offering for engineers, designers, architects, creators and more." Productivity, Capability and Efficiency Where Needed…
…Most AI integrations today are screen-based. Chat windows, text fields, copilots that suggest things for you in a UI you're already in. While this has its place, agents are trapped…
…Together, the ecosystem is designed to deliver optimized hardware and software integration that supports AI-ready creator workflows, from ideation and content creation to rendering and production. The new ProArt P16, P14…
…TSMC 4 nm FinFET GPU Integrated AMD Radeon 890M Graphics (RDNA 3.5 Architecture) 16 Compute Units Up to 3.1 GHz NPU Integrated AMD Ryzen AI Engine (XDNA2 architecture) Up to…
…Cooler Master's active thermal design helps ensure sustained memory performance, signal integrity, and reliable operation during continuous high-load usage. Extreme Speed, Sustained by Dedicated Active Cooling Featuring support for AMD…
AMD today announced that its next-generation AMD EPYC processor, codenamed "Venice," is ramping production in Taiwan on TSMC's advanced 2 nm process technology, with future plans to ramp production at…
…air cooler series, new cooling fan series including a model with integrated displays, new power supplies, and new gaming chairs. Product naming, full specifications, and launch timing for each will be shared…
…The AORUS GeForce RTX 5090 AI BOX features the WATERFORCE all-in-one liquid cooling system, integrating a 240 mm aluminium radiator and dual 120 mm fans for efficient heat dissipation. The…
