…These capabilities are integrated into devices designed for real-world business use, helping organizations adopt new productivity tools while maintaining control over deployment and lifecycle management. With the addition of the ThinkPad…
…Worth noting that neither chip has integrated graphics enabled. Both motherboards share the same base specifications: two DDR4 DIMM slots for up to 64 GB at DDR4-3200, two PCIe 4.0…
…Deep Integration: Model Assessment & Smart ToolsA four-step Model Assessment automatically tests models' generation speeds (TPS) to provide optimized settings and a standardized score for fair, cross-device performance comparisons. Additionally, AI…
…At the Arm Everywhere event on March 24, Arm introduced the Arm AGI CPU, its first production silicon product purpose-built for agentic AI, which puts Arm at the center of the…
…that makes Ubuntu meaningfully more capable for the people who rely on it Ubuntu is not becoming an AI product, but it can become stronger with thoughtful AI integration. Source: Ubuntu blog
…This helps to open doors, in terms of product authenticity, brand reach, and community engagement, that we intend to capitalize on. Combined with continued channel expansion and product innovation across the Fanatec…
XPG, a leading provider of high-performance products for gamers, esports pros, and tech enthusiasts, today announced the launch of its groundbreaking new memory series, NOVAKEY. As the flagship of the series…
…Featuring an advanced haptic touchpad, stunning high‑resolution touchscreen display and an optional integrated privacy screen with anti‑glare on select configurations, it delivers a premium productivity experience wherever work happens. With…
…Agile Micro-Customization Services Beyond delivering flagship products like the FSP2000-57APB, FSP's true competitive edge lies in its agile "Micro-Customization" services. Understanding that every system integrator (SI) and enterprise…
…These efforts build on AMD's deep ecosystem partnerships and long-standing leadership in chiplet architectures, high-bandwidth memory integration, 3D hybrid bonding and rack-scale system design for next-generation AI…
