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… A significant part of this tiered strategy is High Bandwidth Flash HBF . SK hynix describes HBF as a new memory category that applies TSV stacking, similar to HBM, to balance the capacity of traditional NAND with the bandwidth of DRAM. …
… This would increase the company’s flash manufacturing in China by about 50 percent. The Dalian site will continue to focus on mature-node NAND, helping Solidigm boost production of mainstream enterprise flash products while adhering to rules on advanced semiconductor equipment. …
… According to SK hynix, the accelerating adoption of AI services continues to drive demand for enterprise SSDs, NAND flash memory, HBM, and server DRAM. The company also expects emerging agentic and physical AI workloads to further increase demand for NAND-based storage. …
… Sandisk is showing HBF, next-generation NAND, enterprise SSDs, and its updated AI Data Cycle framework at booth 607. The spec release comes in a week thick with memory-hierarchy news; Samsung used its own FMS keynote to preview zHBM and zNAND-O concepts aimed at the same AI inference wall. …
… Faster Interface, Lower Power BiCS10 TLC supports a NAND interface speed of up to 4.8 Gb/s, a 33% improvement over the 8th-generation flash in mass production, giving controller makers the NAND-side bandwidth that coming PCIe Gen6-class SSDs will need. …
… The announcement comes 13 years after Samsung introduced the industry’s first V-NAND technology at the 2013 Flash Memory Summit. The company is targeting V10 BV-NAND for high-capacity, high-performance storage in future AI systems and other data-intensive applications. …
… TrendForce projects NAND flash contract prices rising 10 to 15 percent quarter over quarter in the third quarter of 2026, with conventional DRAM up 13 to 18 percent, and describes the DRAM market as extremely tight. …
… Previous post: SK hynix at FMS 2026: 16-High HBM4, Wafer-Bonded 375-Layer NAND, and a Tiered Memory Pitch
… The company says this approach allows the devices to use multiple qualified NAND suppliers while retaining access to the manufacturing scale and supply-chain capacity of the broader flash industry. …
… 6 TLC NAND Package 1pkg NAND Flash Placement 1pkg NAND Flash Placement 2pkg NAND Flash Placement Interface PCIe®Gen4 x4, NVMe 2.0d PCIe Gen5 x4, NVMe 2.0d PCIe Gen5 x4, NVMe 2.0d SoC 4ch SoC design without DRAM HMB 4ch SoC design without DRAM HMB 8ch SoC design with DRAM Capacities 512 GB, 1024 GB,… …