… It is working toward a 20x improvement in rack-scale AI training and inference efficiency by 2030 , a goal it set in June 2025. The company measures progress against a 2024 baseline using performance-per-watt metrics across representative AMD rack configurations. …
… Sequoia partner Sonya Huang said Etched had made unusual progress for a semiconductor company in less than three years. She said purpose-built inference compute could become dominant as inference expands. …
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… Credit: IBM Speeding the Development Cycle “Bringing fault-tolerant quantum computers to industries depends on several fundamental advances,” said Jay Gambetta, Director of IBM Research and IBM Fellow. “The successful connection and operation of these cryogenic modules signals a leap forward in tha… …
… Together, Lux, Discovery, and associated quantum resources outline a DOE strategy centered on progressively integrating AI, HPC, data, and emerging compute architectures into scientific research workflows. …
… From it, the company draws two claims, both labeled as based on internal testing. The first is an 8x capex efficiency figure, defined as the minimum configuration required to run the model: one HBF GPU against eight HBM GPUs. …
… The release also targets cost and operational efficiency. New capabilities for NAS archiving and long-term retention aim to reduce storage costs, while expanded threat detection extends scanning coverage across AWS, Azure, NAS systems, and Microsoft 365 environments. …
… Metric Target Specification Target Specifications for CPO Nodes Node Bandwidth Density 100 Tb/s per node Energy Efficiency < 1 pJ/bit Chip-to-Chip Interconnect Latency < 10 ns Integration Pathway 2.5D interposer to 3D heterogeneous The roadmap projects an architectural progression moving from stand… …
… The partnership aims to leverage IBM’s quantum software expertise, including the open-source Qiskit ecosystem, alongside AMD’s experience in HPC and AI infrastructure. …
… It features a single blower-style fan that pulls air through the heatsink and exhausts it directly out of the rear I/O bracket. This enclosed cooling design keeps the card’s footprint compact and maintains a clean airflow path through the system. …