…For everyone else, the release is available now via snap install lxd --channel=6/stable , with the snap base moving from core24 to core26. The full release notes are available on Canonical…
…Its platform supports dataset staging, model loading, training, checkpointing, and inference through GPU-adjacent parallel file system performance, RDMA data paths, and POSIX compatibility. The platform combines NVMe flash and HDD storage…
…Together, the companies are developing a full-stack hybrid quantum supercomputing platform that supports multiple quantum hardware approaches and enables closer integration with HPC and AI environments. The collaborations are expected to…
…Quantum Systems Available to DOE Labs IBM said it will make systems including the 156-qubit IBM Quantum Heron and 120-qubit IBM Quantum Nighthawk available to DOE national labs and their…
…The company will test compute, networking, thermal, and orchestration configurations; refine policies governing performance, energy consumption, and cost; train operations personnel; and establish customer environments ahead of campus availability. RAVEL’s Orchestrate…
…Qualcomm has entered into a definitive agreement to acquire Modular Inc., an AI software company whose platform is designed to enable efficient AI execution across heterogeneous hardware architectures. The transaction is expected…
…per second for certain KV cache workloads on the platform, and an early testbed is already running at Pacific Northwest National Laboratory, available to DOE-funded researchers through the AMAIS initiative. For…
…The joint solution integrates NetApp’s data platform with Google Distributed Cloud’s full-stack private cloud architecture. The result is an air-gapped environment that supports sensitive and classified workloads while…
…Its platform is designed to support CPUs, GPUs, NPUs, and custom silicon through a unified software approach, addressing a central challenge for enterprises deploying AI across varied infrastructure architectures. The acquisition expands…
…KIOXIA NX1 Series Specifications Specification Details Form factor and cooling Available in E1.S 9.5 mm (supports direct liquid cooling and air cooling) and E1.S 15 mm form factor (supports…