… HDT enables new classes of applications including lossless wireless audio, low-latency XR streaming, multi-stream sensor aggregation, and high-speed firmware updates. …
imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling by Daniel Nenni on 05-19-2026 at 6:00 am View Forum Posts View Articles Private Message Categories: 3D IC , Chiplet , Foundries , TSMC Key takeaways ▼ imec announced that IC-Link by imec has joined the TSMC 3D… …
AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC by Daniel Nenni on 05-18-2026 at 6:00 am View Forum Posts View Articles Private Message Categories: Alchip , Semiconductor Services Key takeaways ▼ Artificial intelligence processors are entering a new era. …
… The semiconductor industry is entering a new phase of accelerated growth and architectural transformation, driven primarily by artificial intelligence AI and high-performance computing HPC . …
… Also Read: Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle GFL Beyond Tool Interoperability: The Emerging Governed Convergence Problem in Semiconductor Design Closing the Reality Gap: A New Architecture for 1.8-Tb/s Chiplet Governance Share this post via:
… The announcement also highlights expansion into new application domains. …
… Each of these innovations introduces new design and verification challenges. …
… In this new era, success will depend on the ability to deliver not just better chips, but better systems. …
… At the same time, hardware security concerns—including supply chain trust, side-channel attacks, and secure chiplet integration—are driving new research into resilient architectures and trusted design methodologies. …
… It also includes new communication strategies, new materials, new thermal and mechanical problems among others. …