Intel Foundry Expands the 18A Platform with 18A-P and Demonstrates Long-Term Technology Leadership at VLSI 2026 - Semiwiki
… This approach combines traditional front-side contacts with direct backside contacts enabled through PowerVia technology. …
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COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era - Semiwiki
… Contact S2C Also Read: Technical Paper: FPGA Prototyping That Creates Useful PreSilicon Evidence The “New Shift-Left”: Why FPGA Prototyping is the Ultimate RISC-V IP Sandbox Accelerating Advanced FPGA-Based SoC Prototyping With S2C Share this post via:
CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win - Semiwiki
… Also Read: All in One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators Ceva IP: Powering the Era of Physical AI Share this post via:
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025? - Semiwiki
… High-speed interconnects like through-silicon vias TSVs and silicon interposers now enable efficient, low-latency communication, while open standards like UCIe enhance interoperability across vendors. …
Synopsys and TSMC Unite to Power the Future of AI and Multi-Die Innovation - Semiwiki
… The platform automates critical tasks like UCIe and HBM routing, through-silicon via TSV planning, bump alignment, and multi-die verification, slashing design cycles and enhancing productivity. …
The Butterfly in the Room: How an India Shock Breaks the AI Buildout - Semiwiki
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Chips&Media Signs Next-Gen ‘AV2’ Video IP Licensing Deal with North American Big Tech, Strengthening Global Standards Leadership - Semiwiki
… Also Read: Chips&Media’s Next-Generation Video CODEC IP Powers Ambarella’s Expanding Edge AI Portfolio CFrame60: Rewriting the Rules of Frame Compression WAVE-N Specialized Video Processing NPU for Edge AI Systems Share this post via:
Why Choose PCIe 5.0 for Power, Performance and Bandwidth at the Edge? - Semiwiki
… Also Read: Synopsys and TSMC Unite to Power the Future of AI and Multi-Die Innovation AI Everywhere in the Chip Lifecycle: Synopsys at AI Infra Summit 2025 Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions Share this post via:
2026 Outlook with Steve Roddy of Quadric - Semiwiki
… I am the Chief Marketing Officer at Quadric, where I have spent the past four years helping scale the company’s market presence and customer engagement. …
CEO Interview with Vivek Raghunathan of Xscape Photonics - Semiwiki
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